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Sockel Know-How

D - Pinraster (pitch) in mm
B - Gehäusebreite in mm
W - Reihenabstand in mm
mil - Breite in 1/1000 inch
CS - ClamShell ZIF Sockel,
  nur für manuelle Bestückung
OT - OpenTop ZIF Sockel,
  auch maschinelle Bestückung

DIL / DIP

SOIC

Small Outline IC
D 1.27 - B 3.81 - 150 mil
D 1.27 - B 5.08 - 200 mil
D 1.27 - B 7.62 - 300 mil

SOP

Small Outline Package
D 1.27 - B 12.60 - W 16.00

TSOP

Thin Small Outline Package
D 0.50 - B 12.40 - W 14.00
D 0.50 - B 15.40 - W 17.00
D 0.50 - B 18.40 - W 20.00

SSOP

Shrunk Small Outline Package
D 0.65 - B 5.30 - 200 mil
D 0.65 - B 5.60 - 220 mil

TSSOP

Thin Shrunk Small Outline Pkg
D 0.50 - B 4.40 - 170 mil
D 0.65 - B 4.40 - 170 mil

PLCC

Plastic Leaded Chip Carrier
Rechteckig, 4 Reihen
D 1.27
B 10.03x10.03 (20pin)
   12.57x12.57 (28pin)
   15.11x12.57 (32pin)
   17.65x17.65 (44pin)
   20.19x20.19 (52pin)
   25.27x25.27 (68pin)
   30.35x30.35 (84pin)

(T)QFP

(Thin) Quad Flat Pack
Rechteckig, 4 Reihen
D 0.80 - B  7.0 x 7.0 (32pin)
D 0.80 - B 10.0x10.0 (44pin)
D 0.50 - B  7.0 x 7.0 (48pin)
D 0.65 - B 10.0x10.0 (52pin)
D 0.50 - B 10.0x10.0 (64pin)
D 0.50 - B 12.0x12.0 (80pin)
D 0.50 - B 14.0x14.0 (100pin)
D 0.65 - B 14.0x20.0 (100pin)
D 0.50 - B 16.0x16.0 (120pin)
D 0.50 - B 20.0x20.0 (144pin)
D 0.50 - B 24.0x24.0 (176pin)
D 0.50 - B 28.0x28.0 (208pin)

QFN / MLF

Rechteckig, 4 Reihen
D 0.50 - B  5.0 x 5.0 (32pin)
D 0.50 - B  7.0 x 7.0 (44pin)